3D Enclosure Design System

Frame-Based Enclosures

Base Elements

Designed for resin (SLA) printers

1. Standard mesh patterns for cooling / ventilation
2. Range of standard frame sizes and intermediate ones
3. Standard proportions for all elements: chamfers | windows | frame thickness | frame width and length | terminal block sizes | holes

Materials

Main materials:

1. Photopolymer resins
2. PETG, PLA and other plastics
3. Tempered and reinforced glass
4. Epoxy (colored and opaque — scarlet, yellow, etc.) / Silicone / Rubber / Soldering
5. Copper / Stainless steel / Brass / Titanium / Silver
6. Chemical deposition coating with any available chemical elements

Enclosure

Concept:

1. Rigid hollow frame, similar to a double-glazed window unit
2. This rigid frame should have surfaces for laying glass / plastic panels / steel panels / films
3. Glass is attached mechanically / with epoxy
4. Empty space between controllers and the enclosure is filled with epoxy / silicone / air
5. Frame shape can be anything: half-frame / curved / L-shaped / Petals (when the frame is inside the device, cross peace symbol, etc.)
6. Information plates / QR codes can be placed between the glass panels
7. Board mounting is done by soldering the frame to ground contacts / via pincer clamps / mechanical fixation
8. Corners of the glass frames should have round blind recesses to simplify glass installation

External Mounting

1. DIN rail
2. Through-holes, like on shipping containers, for inter-mounting or key mounting
3. MagSafe, for mounting on a magnetic insert
4. Dovetails: Spring-loaded | With a latch | With double-press
5. Ribbing | Round recesses | Medium recesses | Plain recesses | Grooves | Frame taper — for friction or mechanical mounting to the outside world
6. Single-topology positioning: Corner bevels | Various types of keys | Possibly a mechanism like micro SD

Connectors

Highly dependent on the build: waterproof, vibration-resistant, etc.

1. Straight through-holes in the enclosure for data cables, etc.
2. Connectors integrated into the outer boundary through an insulation layer
3. Terminal blocks like on the Flipper but with protruding connectors, which can be hidden by design elements to prevent bending
4. Possibly something like mushroom anchors to prevent contact breakage
5. Standard flat terminal blocks for main interfaces: Reset and flash jumpers / SPI / CAN / I2C / I2S / Type-C / USB 2.0 / etc. Attached via countersunk studs. All such terminal blocks should be versioned
6. Standard flat terminal block for specific MCUs, with versions — this would greatly simplify integration between devices using the same MCUs
7. Standard reinforced connectors for attaching external sensors

Variations range from fully breathable to solid plastic-metal bricks with terminal blocks that can be connected to via special studs

Power

1. Installing an 18650 in place of one of the frames
2. Installing an 18650 as an external element
3. Installing an 18650 as an additional module
4. From external sources via Type-C for example
5. Installing smaller batteries in special enclosure extensions
6. Via terminal blocks
7. Quick-swap capability for 18650 is essential
   • Like an SD card with a click, similar to fuses in old devices
   • A battery cradle may be needed for this to work
   • Can be built into a desk, etc., an embedded enclosure type where only connectors and battery are exposed

Cooling

1. By soldering ground wires to the board and the external frame
2. Via additional copper plates from the frame to heated components

Casting Machine

1. Vacuum chamber
2. Induction melting
3. Mold heating system
4. Mold cooling system through the bottom